Manufacturing Description
Module Manufacturer:Samsung
Module Part Number:M378A1K43BB2-CRC
DRAM Manufacturer:Samsung
DRAM Components:K4A8G085WB-BCRC
DRAM Die Revision / Process Node:B / 20 nm
Module Manufacturing Date:Week 38, 2018
Module Manufacturing Location:Suzhou, China (SESS)
Module Serial Number:713704ADh
Manufacturing Identification Label:U0OR000—
Module PCB Revision:00h
Physical & Logical Attributes
Fundamental Memory Class:DDR4 SDRAM
Module Speed Grade:DDR4-2400T downbin
Base Module Type:UDIMM (133,35 mm)
Module Capacity:8192 MB
Reference Raw Card:A2 (8 layers)
JEDEC Raw Card Designer:Not determined
Module Nominal Height:31 < H <= 32 mm
Module Thickness Maximum, Front:1 < T <= 2 mm
Module Thickness Maximum, Back:1 < T <= 2 mm
Number of DIMM Ranks:1
Address Mapping from Edge Connector to DRAM:Standard
DRAM Device Package:Standard Monolithic
DRAM Device Package Type: 78-ball FBGA
DRAM Device Die Count:Single die
Signal Loading:Not specified
Number of Column Addresses:10 bits
Number of Row Addresses:16 bits
Number of Bank Addresses:2 bits (4 banks)
Bank Group Addressing:2 bits (4 groups)
DRAM Device Width:8 bits
Programmed DRAM Density:8 Gb
Calculated DRAM Density:8 Gb
Number of DRAM components:8
DRAM Page Size:1 KB
Primary Memory Bus Width:64 bits
Memory Bus Width Extension:0 bits
DRAM Post Package Repair:Supported
Soft Post Package Repair:Supported
DRAM Timing Parameters
Fine Timebase:0,001 ns
Medium Timebase:0,125 ns
CAS Latencies Supported:10T, 11T, 12T, 13T,
14T, 15T, 16T, 17T,
18T
Minimum Clock Cycle Time (tCK min):0,833 ns (1200,48 MHz)
Maximum Clock Cycle Time (tCK max):1,600 ns (625,00 MHz)
CAS# Latency Time (tAA min):13,750 ns
RAS# to CAS# Delay Time (tRCD min):13,750 ns
Row Precharge Delay Time (tRP min):13,750 ns
Active to Precharge Delay Time (tRAS min):32,000 ns
Act to Act/Refresh Delay Time (tRC min):45,750 ns
Normal Refresh Recovery Delay Time (tRFC1 min):350,000 ns
2x mode Refresh Recovery Delay Time (tRFC2 min):260,000 ns
4x mode Refresh Recovery Delay Time (tRFC4 min):160,000 ns
Short Row Active to Row Active Delay (tRRD_S min):3,300 ns
Long Row Active to Row Active Delay (tRRD_L min):4,900 ns
Write Recovery Time (tWR min):15,000 ns
Short Write to Read Command Delay (tWTR_S min):2,500 ns
Long Write to Read Command Delay (tWTR_L min):7,500 ns
Long CAS to CAS Delay Time (tCCD_L min):5,000 ns
Four Active Windows Delay (tFAW min):21,000 ns
Maximum Active Window (tMAW):8192*tREFI
Maximum Activate Count (MAC):Unlimited MAC
DRAM VDD 1,20 V operable/endurant:Yes/Yes
Thermal Parameters
Module Thermal Sensor:Not Incorporated
SPD Protocol
SPD Revision:1.1
SPD Bytes Total:512
SPD Bytes Used:384
SPD Checksum (Bytes 00h-7Dh):BD97h (OK)
SPD Checksum (Bytes 80h-FDh):B9C3h (OK)
Part number details
JEDEC DIMM Label:8GB 1Rx8 PC4-2400T-UA2-11
Classification:DDR4 SDRAM (1.2V VDD)
Module Type:240-pin Unbuffered DIMM
Module Speed:DDR4-2400 17-17-17
Module Revision:2
Component Density:16 Banks & POD-1.2V
Component Configuration:x8
Memory Depth:1G (for 2Gb)
Data Width:64-bit
Die Generation:B (3rd Gen)
Package Type:FBGA (Lead & Halogen Free)
AMB Vendor & Revision:N/A
Power Consumption:0°C-85°C / Normal Power
FrequencyCASRCDRPRASRCRRDSRRDLWRWTRSWTRLFAW
1200 MHz181717395546183926
1200 MHz171717395546183926
1067 MHz161515354946163823
1067 MHz151515354946163823
933 MHz141313304345143720
933 MHz131313304345143720
800 MHz121111263734122617
800 MHz111111263734122617
667 MHz101010223134102514